Be prepared for the next generation of computers and smartphones are up to 1000 times faster than the systems you use today. Computer manufacturer IBM is developing the "skyscrapers" of computers that use huge sandwich of silicon chips by pressing layer after layer of chips covered with tiny components together.
The process by which IBM has roped the creator 3M glue, make computers and smartphones, up to 1000 times faster than today, and is expected to be commercially available by 2013.
3M currently heat-resistant glue, adhesives used in aerospace and tape, but hi-tech glue made for IBM could indeed be the decisive step towards making the leap in computing the evolution next the Daily Mail.
Attempts vertical stack - known as 3D packaging - has so far been suffering from overheating. But the new adhesives can conduct heat through a thick pile and away from the logic circuits that could be burned by the heat. The research aims to create "stacks" of up to 100 layers of silicon, the report said.
Mike Bowman, marketing director for 3M, said: "This material is integrated into computer chips when connected to printed circuit boards - the only part of what we do is we take our heat glue on the edge of the sandwich. That distributes heat more evenly across the chip. With conventional chips with only one or two layers, but once that is gathering the files, the problem can be very serious. "
No comments:
Post a Comment